| 000 | 01530nam a2200397 a 4500 | ||
|---|---|---|---|
| 001 | EBC822735 | ||
| 003 | MiAaPQ | ||
| 005 | 20240120133047.0 | ||
| 006 | m o d | | ||
| 007 | cr cn||||||||| | ||
| 008 | 120218s2012 gw a sbf 001 0 eng d | ||
| 020 | _z9783527326464 | ||
| 020 | _a9783527644247 (electronic bk.) | ||
| 035 | _a(MiAaPQ)EBC822735 | ||
| 035 | _a(Au-PeEL)EBL822735 | ||
| 035 | _a(CaPaEBR)ebr10529302 | ||
| 035 | _a(CaONFJC)MIL363975 | ||
| 035 | _a(OCoLC)775301857 | ||
| 040 |
_aMiAaPQ _cMiAaPQ _dMiAaPQ |
||
| 050 | 4 |
_aTK7871.85 _b.H36 2012 |
|
| 245 | 0 | 0 |
_aHandbook of wafer bonding _h[electronic resource] / _cedited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. |
| 260 |
_aWeinheim, Germany : _bWiley-VCH, _c2012. |
||
| 300 |
_axxxi, 395 p. : _bcol. ill. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | _apt. 1. Technologies -- pt. 2. Applications. | |
| 533 | _aElectronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. | ||
| 650 | 0 |
_aSemiconductors _xBonding _vHandbooks, manuals, etc. |
|
| 650 | 0 | _aSemiconductor wafers. | |
| 650 | 0 |
_aMicroelectromechanical systems _xDesign and construction. |
|
| 655 | 4 | _aElectronic books. | |
| 700 | 1 | _aRamm, Peter. | |
| 700 | 1 | _aLu, James Jian-Qiang. | |
| 700 | 1 | _aTaklo, Maaike M. V. | |
| 710 | 2 | _aProQuest (Firm) | |
| 856 | 4 | 0 |
_uhttps://ebookcentral.proquest.com/lib/bacm-ebooks/detail.action?docID=822735 _zClick to View |
| 999 |
_c72476 _d72476 |
||