000			01568nam a2200397 a 4500
001			EBC731200
003			MiAaPQ
005			20240120132643.0
006			m o d |
007			cr cn|||||||||
008			110308s2010 njuac sb 001 0 eng d
010			_z 2011280775
020			_z9814273325
020			_z9789814273329
020			_a9789814273336 (electronic bk.)
035			_a(MiAaPQ)EBC731200
035			_a(Au-PeEL)EBL731200
035			_a(CaPaEBR)ebr10480052
035			_a(CaONFJC)MIL314371
035			_a(OCoLC)714877548
040			_aMiAaPQ _cMiAaPQ _dMiAaPQ
050		4	_aTK7874.76 _b.T36 2010
100	1		_aTan, Cher Ming, _d1959-
245	1	0	_aElectromigration in ULSI interconnections _h[electronic resource] / _cCher Ming Tan.
260			_aHackensack, N.J. : _bWorld Scientific, _cc2010.
300			_axix, 291 p. : _bill. (some col.), col. port.
490	1		_aInternational series on advances in solid state electronics and technology (ASSET)
504			_aIncludes bibliographical references and index.
533			_aElectronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
650		0	_aIntegrated circuits _xUltra large scale integration.
650		0	_aElectrodiffusion.
655		4	_aElectronic books.
710	2		_aProQuest (Firm)
830		0	_aInternational series on advances in solid state electronics and technology.
856	4	0	_uhttps://ebookcentral.proquest.com/lib/bacm-ebooks/detail.action?docID=731200 _zClick to View
999			_c66854 _d66854