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001			EBC3376830
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005			20240121043912.0
006			m o d |
007			cr cn|||||||||
008			900201s1990 dcua sb 000 0 eng d
010			_z 90060385
020			_z030904233X
035			_a(MiAaPQ)EBC3376830
035			_a(Au-PeEL)EBL3376830
035			_a(CaPaEBR)ebr10060398
035			_a(CaONFJC)MIL21251
035			_a(OCoLC)923266410
040			_aMiAaPQ _cMiAaPQ _dMiAaPQ
050		4	_aTK7870.15 _b.N38 1990
082	0	4	_a621.381/046 _220
110	2		_aNational Research Council (U.S.). _bCommittee on Materials for High-Density Electronic Packaging.
245	1	0	_aMaterials for high-density electronic packaging and interconnection _h[electronic resource] : _breport of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
260			_aWashington, D.C. : _bNational Academy Press ; _aAlexandria, VA : _bAvailable from Defense Technical Information Center, Cameron Station, _c1990.
300			_axiv, 139 p. : _bill.
500			_a"NMAB-449."
504			_aIncludes bibliographical references.
533			_aElectronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
650		0	_aElectronic packaging _xMaterials.
650		0	_aElectrical engineering _xMaterials.
655		4	_aElectronic books.
710	2		_aProQuest (Firm)
856	4	0	_uhttps://ebookcentral.proquest.com/lib/bacm-ebooks/detail.action?docID=3376830 _zClick to View
999			_c202629 _d202629