000			02248nam a2200529 i 4500
001			EBC1680609
003			MiAaPQ
005			20240120162318.0
006			m o d |
007			cr cnu||||||||
008			140506t20142014gw a ob 001 0 eng d
020			_z9783527334667
020			_a9783527670130 _q(electronic bk.)
020			_a9783527670123 _q(electronic bk.)
020			_a9783527670116 _q(electronic bk.)
020			_a9783527670109 _q(electronic bk.)
035			_a(MiAaPQ)EBC1680609
035			_a(Au-PeEL)EBL1680609
035			_a(CaPaEBR)ebr10865387
035			_a(CaONFJC)MIL601769
035			_a(OCoLC)878919955
040			_aMiAaPQ _beng _erda _epn _cMiAaPQ _dMiAaPQ
050		4	_aTK7874 _b.H363 2014
082	0		_a621.3815 _223
245	0	0	_aHandbook of 3D integration. _nVolume 3, _p3D process technology / _cedited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors.
264		1	_aWeinheim, Germany : _bWiley-VCH, _c2014.
264		4	_c2014
300			_a1 online resource (475 pages) : _billustrations (some color)
336			_atext _2rdacontent
337			_acomputer _2rdamedia
338			_aonline resource _2rdacarrier
504			_aIncludes bibliographical references at the end of each chapters and index.
588			_aDescription based on online resource; title from PDF title page (ebrary, viewed May 5, 2014).
590			_aElectronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
650		0	_aIntegrated circuits.
650		0	_aIntegrated circuits _xDesign and construction.
650		0	_aSilicon.
650		0	_aThree-dimensional imaging.
655		4	_aElectronic books.
700	1		_aGarrou, Philip, _eeditor.
700	1		_aKoyanagi, Mitsumasa, _eeditor.
700	1		_aRamm, Peter, _eeditor.
700	1		_aAllen, Ricky, _econtributor.
776	0	8	_iPrint version: _tHandbook of 3D integration. Volume 3, 3D process technology. _dWeinheim, Germany : Wiley-VCH, c2014 _hxxii, 451 pages _z9783527334667
797	2		_aProQuest (Firm)
856	4	0	_uhttps://ebookcentral.proquest.com/lib/bacm-ebooks/detail.action?docID=1680609 _zClick to View
999			_c112164 _d112164