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		Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu. by Liu, S. (Sheng), 1963- \| Liu, Yong, 1962- \| ProQuest (Firm). Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Hoboken, N.J. : Wiley, 2011Online access: Click to View Availability: No items available. Add to cart (remove)
		No cover image available LCP for microwave packages and modules [electronic resource] / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara. by Pham, Anh-Vu H \| Chen, Morgan J \| Aihara, Kunia \| ProQuest (Firm). Series: Cambridge RF and microwave engineering seriesMaterial type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Cambridge ; New York : Cambridge University Press, 2012Other title: Liquid crystal polymer for microwave packages and modules.Online access: Click to View Availability: No items available. Add to cart (remove)
		Microwave and millimeter-wave electronic packaging / Rick Sturdivant. by Sturdivant, Rick [author.]. Series: Artech House microwave libraryMaterial type: Text; Format: available online ; Literary form: Not fiction Publisher: Boston, [Massachusetts] ; London, [England] : Artech House, 2014Copyright date: 2014Online access: Click to View Availability: No items available. Add to cart (remove)
		Adhesion in microelectronics / edited by K. L. Mittal and Tanweer Ahsan. by Mittal, K. L, 1945- [editor.] \| Ahsan, Tanweer [editor.]. Series: Adhesion and adhesivesFundamental and applied aspectsMaterial type: Text; Format: available online ; Literary form: Not fiction Publisher: Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014Copyright date: 2014Online access: Click to View Availability: No items available. Add to cart (remove)
		Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu. by Wu, Andy [editor.]. Series: Applied mechanics and materials ; Volume 509.Material type: Text; Format: available online ; Literary form: Not fiction Publisher: Zurich, Switzerland : TTP, 2014Copyright date: 2014Online access: Click to View Availability: No items available. Add to cart (remove)
		Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu. by Wu, Andy [editor.]. Series: Applied mechanics and materials ; Volume 509.Material type: Text; Format: available online ; Literary form: Not fiction Publisher: Zurich, Switzerland : TTP, 2014Copyright date: 2014Online access: Click to View Availability: No items available. Add to cart (remove)
		No cover image available Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan. by Shangguan, Dongkai, 1963- \| ProQuest (Firm). Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Materials Park, OH : ASM International, 2005Online access: Click to View Availability: No items available. Add to cart (remove)
		No cover image available Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan. by Shangguan, Dongkai, 1963- \| ProQuest (Firm). Material type: Text; Format: electronic available online ; Literary form: Not fiction Publication details: Materials Park, OH : ASM International, 2005Online access: Click to View Availability: No items available. Add to cart (remove)
		IMAPS (2016) / guest editor, Dr. Agata Skwarek. by Skwarek, Agata [editor.]. Series: Circuit World ; Volume 43, Number 1Material type: Text; Format: available online ; Literary form: Not fiction Publisher: [Bradford, England] : Emerald Publishing Limited, 2017Copyright date: 2017Online access: Click to View Availability: No items available. Add to cart (remove)
		IMAPS (2016) / guest editor, Dr. Agata Skwarek. by Skwarek, Agata [editor.]. Series: Circuit World ; Volume 43, Number 1Material type: Text; Format: available online ; Literary form: Not fiction Publisher: [Bradford, England] : Emerald Publishing Limited, 2017Copyright date: 2017Online access: Click to View Availability: No items available. Add to cart (remove)
		IMAPS Poland 2016 / guest editor, Dr. Agata Skwarek. by Skwarek, Agata [editor.]. Series: Soldering & Surface Mount Technology ; Volume 29, Number 1Material type: Text; Format: available online ; Literary form: Not fiction Publisher: [Bradford, England] : Emerald Publishing Limited, 2017Copyright date: 2017Online access: Click to View Availability: No items available. Add to cart (remove)
		IMAPS Poland 2016 / guest editor, Dr. Agata Skwarek. by Skwarek, Agata [editor.]. Series: Soldering & Surface Mount Technology ; Volume 29, Number 1Material type: Text; Format: available online ; Literary form: Not fiction Publisher: [Bradford, England] : Emerald Publishing Limited, 2017Copyright date: 2017Online access: Click to View Availability: No items available. Add to cart (remove)