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Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.

by Ramm, Peter | Lu, James Jian-Qiang | Taklo, Maaike M. V | ProQuest (Firm).

Material type: Text Text; Format: electronic available online remote; Literary form: Not fiction Publication details: Weinheim, Germany : Wiley-VCH, 2012Online access: Click to View Availability: No items available.

Handbook of 3D integration. Volume 3, 3D process technology / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors.

by Garrou, Philip [editor.] | Koyanagi, Mitsumasa [editor.] | Ramm, Peter [editor.] | Allen, Ricky [contributor.].

Material type: Text Text; Format: available online remote; Literary form: Not fiction Publisher: Weinheim, Germany : Wiley-VCH, 2014Copyright date: 2014Online access: Click to View Availability: No items available.

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