TY  - BOOK
AU  - Ramm,Peter
AU  - Lu,James Jian-Qiang
AU  - Taklo,Maaike M.V.
ED  - ProQuest (Firm)
TI  - Handbook of wafer bonding
AV  - TK7871.85 .H36 2012
PY  - 2012///
CY  - Weinheim, Germany
PB  - Wiley-VCH
KW  - Semiconductors
KW  - Bonding
KW  - Handbooks, manuals, etc
KW  - Semiconductor wafers
KW  - Microelectromechanical systems
KW  - Design and construction
KW  - Electronic books
N1  - Includes bibliographical references and index; pt. 1. Technologies -- pt. 2. Applications; Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries
UR  - https://ebookcentral.proquest.com/lib/bacm-ebooks/detail.action?docID=822735
ER  -