Handbook of wafer bonding  [electronic resource] / 
edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. 
 - Weinheim, Germany :  Wiley-VCH,  2012. 
 - xxxi, 395 p. :  col. ill. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/>pt. 1. Technologies -- pt. 2. Applications. 
<br/><br/><br/>Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. 
<br/><br/><label>ISBN: </label>9783527644247 (electronic bk.) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Semiconductors--Bonding--Handbooks, manuals, etc.<br/>Semiconductor wafers.<br/>Microelectromechanical systems--Design and construction.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7871.85  / .H36 2012