TY  - BOOK
AU  - Li,Suny
TI  - SiP-system in package design and simulation: MentorGraphics Expedition Enterprise Flow advanced design guide 
AV  - TK7874 .L5 2017
U1  - 621.3815 23
PY  - 2017///
CY  - Hoboken, New Jersey, Fusionopolis, Solaris South Tower, Singapore
PB  - Publishing House of Electronics Industry, Wiley
KW  - Integrated circuits
KW  - Design and construction
KW  - Multichip modules (Microelectronics)
KW  - Electronic books
N1  - Includes bibliographical references and indexes
UR  - https://ebookcentral.proquest.com/lib/bacm-ebooks/detail.action?docID=4915580
ER  -