TY  - BOOK
ED  - National Research Council (U.S.).
ED  - ProQuest (Firm)
TI  - Materials for high-density electronic packaging and interconnection: report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council
AV  - TK7870.15 .N38 1990
U1  - 621.381/046 20
PY  - 1990///
CY  - Washington, D.C., Alexandria, VA
PB  - National Academy Press, Available from Defense Technical Information Center, Cameron Station
KW  - Electronic packaging
KW  - Materials
KW  - Electrical engineering
KW  - Electronic books
N1  - "NMAB-449."; Includes bibliographical references; Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries
UR  - https://ebookcentral.proquest.com/lib/bacm-ebooks/detail.action?docID=3376830
ER  -