Materials for high-density electronic packaging and interconnection  report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.  [electronic resource] : 

 - Washington, D.C. :  Alexandria, VA :  National Academy Press ;  Available from Defense Technical Information Center, Cameron Station,  1990. 
 - xiv, 139 p. :  ill. 
<br/><br/> "NMAB-449." 
<br/><br/>Includes bibliographical references. 
<br/><br/><br/>Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. 
<br/><br/><label>ISBN: </label>
<br/><br/><label>LCCN: </label>
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Materials.<br/>Electrical engineering--Materials.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7870.15  / .N38 1990 
<br/><br/><label>Dewey Class. No.: </label>621.381/046