Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.

Contributor(s): Ramm, Peter | Lu, James Jian-Qiang | Taklo, Maaike M. V | ProQuest (Firm)Material type: TextTextPublication details: Weinheim, Germany : Wiley-VCH, 2012Description: xxxi, 395 p. : col. illISBN: 9783527644247 (electronic bk.)Subject(s): Semiconductors -- Bonding -- Handbooks, manuals, etc | Semiconductor wafers | Microelectromechanical systems -- Design and constructionGenre/Form: Electronic books.LOC classification: TK7871.85 | .H36 2012Online resources: Click to View
Contents:
pt. 1. Technologies -- pt. 2. Applications.
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Includes bibliographical references and index.

pt. 1. Technologies -- pt. 2. Applications.

Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.

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