SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide / Suny Li.
Material type: TextPublisher: Hoboken, New Jersey ; Fusionopolis, Solaris South Tower, Singapore : Publishing House of Electronics Industry : Wiley, 2017Copyright date: 2017Description: 1 online resource (486 pages) : illustrations (some color)Content type: text Media type: computer Carrier type: online resourceISBN: 9781119046011Subject(s): Integrated circuits -- Design and construction | Multichip modules (Microelectronics) -- Design and constructionGenre/Form: Electronic books.Additional physical formats: Print version:: SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide.DDC classification: 621.3815 LOC classification: TK7874 | .L5 2017Online resources: Click to ViewNo physical items for this record
Includes bibliographical references and indexes.
Description based on print version record.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2016. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
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