Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
Material type: TextSeries: Soldering & surface mount technology ; v.18, no. 2Publication details: Bradford, England : Emerald Group Publishing, c2006Description: 72 pSubject(s): Manufacturing processes | Electronic packagingGenre/Form: Electronic books.LOC classification: TK7870.15 | .A48 2006Online resources: Click to ViewNo physical items for this record
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
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