Materials for high-density electronic packaging and interconnection [electronic resource] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

By: National Research Council (U.S.). Committee on Materials for High-Density Electronic PackagingContributor(s): ProQuest (Firm)Material type: TextTextPublication details: Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990Description: xiv, 139 p. : illSubject(s): Electronic packaging -- Materials | Electrical engineering -- MaterialsGenre/Form: Electronic books.DDC classification: 621.381/046 LOC classification: TK7870.15 | .N38 1990Online resources: Click to View
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"NMAB-449."

Includes bibliographical references.

Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.

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