Handbook of wafer bonding
Handbook of wafer bonding [electronic resource] /
edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.
- Weinheim, Germany : Wiley-VCH, 2012.
- xxxi, 395 p. : col. ill.
Includes bibliographical references and index.
pt. 1. Technologies -- pt. 2. Applications.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
9783527644247 (electronic bk.)
Semiconductors--Bonding--Handbooks, manuals, etc.
Semiconductor wafers.
Microelectromechanical systems--Design and construction.
Electronic books.
TK7871.85 / .H36 2012
Includes bibliographical references and index.
pt. 1. Technologies -- pt. 2. Applications.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
9783527644247 (electronic bk.)
Semiconductors--Bonding--Handbooks, manuals, etc.
Semiconductor wafers.
Microelectromechanical systems--Design and construction.
Electronic books.
TK7871.85 / .H36 2012